857 lines
20 KiB
Plaintext
857 lines
20 KiB
Plaintext
(kicad_pcb
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(version 20240108)
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(generator "pcbnew")
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(generator_version "8.0")
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(general
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(thickness 1.6)
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(legacy_teardrops no)
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)
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(paper "A")
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(title_block
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(title "${PROJECT_NAME}")
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(rev "${PCB_REVISION}")
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(company "BRENDANHAINES.COM")
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)
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(layers
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(0 "F.Cu" signal)
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(1 "In1.Cu" signal)
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(2 "In2.Cu" signal)
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(31 "B.Cu" signal)
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(32 "B.Adhes" user "B.Adhesive")
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(33 "F.Adhes" user "F.Adhesive")
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(34 "B.Paste" user)
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(35 "F.Paste" user)
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(36 "B.SilkS" user "B.Silkscreen")
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(37 "F.SilkS" user "F.Silkscreen")
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(38 "B.Mask" user)
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(39 "F.Mask" user)
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(40 "Dwgs.User" user "User.Drawings")
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(41 "Cmts.User" user "User.Comments")
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(42 "Eco1.User" user "User.Eco1")
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(43 "Eco2.User" user "User.Eco2")
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(44 "Edge.Cuts" user)
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(45 "Margin" user)
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(46 "B.CrtYd" user "B.Courtyard")
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(47 "F.CrtYd" user "F.Courtyard")
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(48 "B.Fab" user)
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(49 "F.Fab" user)
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(50 "User.1" user)
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(51 "User.2" user)
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(52 "User.3" user)
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(53 "User.4" user)
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(54 "User.5" user)
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(55 "User.6" user)
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(56 "User.7" user)
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(57 "User.8" user)
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(58 "User.9" user)
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)
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(setup
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(stackup
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(layer "F.SilkS"
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(type "Top Silk Screen")
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(color "White")
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)
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(layer "F.Paste"
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(type "Top Solder Paste")
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)
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(layer "F.Mask"
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(type "Top Solder Mask")
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(color "Green")
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(thickness 0.01)
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)
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(layer "F.Cu"
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(type "copper")
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(thickness 0.035)
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)
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(layer "dielectric 1"
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(type "core")
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(thickness 0.48)
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(material "FR4")
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(epsilon_r 4.5)
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(loss_tangent 0.02)
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)
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(layer "In1.Cu"
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(type "copper")
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(thickness 0.035)
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)
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(layer "dielectric 2"
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(type "prepreg")
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(thickness 0.48)
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(material "FR4")
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(epsilon_r 4.5)
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(loss_tangent 0.02)
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)
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(layer "In2.Cu"
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(type "copper")
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(thickness 0.035)
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)
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(layer "dielectric 3"
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(type "core")
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(thickness 0.48)
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(material "FR4")
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(epsilon_r 4.5)
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(loss_tangent 0.02)
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)
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(layer "B.Cu"
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(type "copper")
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(thickness 0.035)
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)
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(layer "B.Mask"
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(type "Bottom Solder Mask")
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(color "Green")
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(thickness 0.01)
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)
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(layer "B.Paste"
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(type "Bottom Solder Paste")
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)
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(layer "B.SilkS"
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(type "Bottom Silk Screen")
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(color "White")
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)
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(copper_finish "ENIG")
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(dielectric_constraints no)
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)
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(pad_to_mask_clearance 0)
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(allow_soldermask_bridges_in_footprints no)
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(pcbplotparams
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(layerselection 0x00010fc_ffffffff)
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(plot_on_all_layers_selection 0x0000000_00000000)
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(disableapertmacros no)
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(usegerberextensions no)
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(usegerberattributes yes)
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(usegerberadvancedattributes yes)
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(creategerberjobfile yes)
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(dashed_line_dash_ratio 12.000000)
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(dashed_line_gap_ratio 3.000000)
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(svgprecision 4)
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(plotframeref no)
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(viasonmask no)
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(mode 1)
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(useauxorigin no)
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(hpglpennumber 1)
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(hpglpenspeed 20)
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(hpglpendiameter 15.000000)
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(pdf_front_fp_property_popups yes)
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(pdf_back_fp_property_popups yes)
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(dxfpolygonmode yes)
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(dxfimperialunits yes)
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(dxfusepcbnewfont yes)
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(psnegative no)
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(psa4output no)
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(plotreference yes)
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(plotvalue yes)
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(plotfptext yes)
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(plotinvisibletext no)
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(sketchpadsonfab no)
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(subtractmaskfromsilk no)
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(outputformat 1)
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(mirror no)
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(drillshape 1)
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(scaleselection 1)
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(outputdirectory "")
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)
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)
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(property "PCB_REVISION" "0.0")
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(property "PROJECT_NAME" "PROJECT_NAME")
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(net 0 "")
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(net 1 "GND")
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(footprint "common:MH120X230_#4"
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(layer "F.Cu")
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(uuid "0ed882a0-e4ce-4f18-bef6-9c3cccbc2678")
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(at 123.19 123.19)
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(descr "Mounting Hole, #4")
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(property "Reference" "MH3"
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(at 0 0 0)
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(layer "F.SilkS")
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(hide yes)
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(effects
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)
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)
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(property "Value" "Mounting_Hole"
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(at 0 0 0)
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(layer "F.Fab")
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(hide yes)
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(uuid "27613306-b783-4cb9-acf3-88e3b21dd5a5")
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(effects
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(property "Footprint" ""
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(hide yes)
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(property "Datasheet" ""
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(property "Description" "Hole"
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(at 0 0 0)
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(effects
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(path "/79801d06-18e7-498c-8d4e-cc6cc5060c9d")
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(sheetfile "jlcpcb_template.kicad_sch")
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(zone_connect 2)
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(attr exclude_from_pos_files)
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(fp_circle
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(center 0 0)
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(end 3.175 0)
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(stroke
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(width 0.1778)
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(type solid)
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(fill none)
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(pad "1" thru_hole circle
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(at 0 0)
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(size 5.842 5.842)
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(drill 3.048)
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(layers "*.Cu" "*.Mask")
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(remove_unused_layers no)
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(net 1 "GND")
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(pinfunction "1")
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(pintype "passive")
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(uuid "706a15cb-e926-49ae-94cd-c84e7fda89cd")
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(footprint "common:LOGO_BH"
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(layer "F.Cu")
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(uuid "2c2034ad-58b7-4a90-9915-abf69702fa36")
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(property "Reference" "LOGO1"
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(property "Value" "~"
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