(kicad_pcb
	(version 20240108)
	(generator "pcbnew")
	(generator_version "8.0")
	(general
		(thickness 1.6)
		(legacy_teardrops no)
	)
	(paper "A")
	(title_block
		(title "${PROJECT_NAME}")
		(rev "${PCB_REVISION}")
		(company "BRENDANHAINES.COM")
	)
	(layers
		(0 "F.Cu" signal)
		(1 "In1.Cu" signal)
		(2 "In2.Cu" signal)
		(31 "B.Cu" signal)
		(32 "B.Adhes" user "B.Adhesive")
		(33 "F.Adhes" user "F.Adhesive")
		(34 "B.Paste" user)
		(35 "F.Paste" user)
		(36 "B.SilkS" user "B.Silkscreen")
		(37 "F.SilkS" user "F.Silkscreen")
		(38 "B.Mask" user)
		(39 "F.Mask" user)
		(40 "Dwgs.User" user "User.Drawings")
		(41 "Cmts.User" user "User.Comments")
		(42 "Eco1.User" user "User.Eco1")
		(43 "Eco2.User" user "User.Eco2")
		(44 "Edge.Cuts" user)
		(45 "Margin" user)
		(46 "B.CrtYd" user "B.Courtyard")
		(47 "F.CrtYd" user "F.Courtyard")
		(48 "B.Fab" user)
		(49 "F.Fab" user)
		(50 "User.1" user)
		(51 "User.2" user)
		(52 "User.3" user)
		(53 "User.4" user)
		(54 "User.5" user)
		(55 "User.6" user)
		(56 "User.7" user)
		(57 "User.8" user)
		(58 "User.9" user)
	)
	(setup
		(stackup
			(layer "F.SilkS"
				(type "Top Silk Screen")
				(color "White")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(color "Green")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 1"
				(type "core")
				(thickness 0.48)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In1.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 2"
				(type "prepreg")
				(thickness 0.48)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In2.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 3"
				(type "core")
				(thickness 0.48)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(color "Green")
				(thickness 0.01)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
				(color "White")
			)
			(copper_finish "ENIG")
			(dielectric_constraints no)
		)
		(pad_to_mask_clearance 0)
		(allow_soldermask_bridges_in_footprints no)
		(pcbplotparams
			(layerselection 0x00010fc_ffffffff)
			(plot_on_all_layers_selection 0x0000000_00000000)
			(disableapertmacros no)
			(usegerberextensions no)
			(usegerberattributes yes)
			(usegerberadvancedattributes yes)
			(creategerberjobfile yes)
			(dashed_line_dash_ratio 12.000000)
			(dashed_line_gap_ratio 3.000000)
			(svgprecision 4)
			(plotframeref no)
			(viasonmask no)
			(mode 1)
			(useauxorigin no)
			(hpglpennumber 1)
			(hpglpenspeed 20)
			(hpglpendiameter 15.000000)
			(pdf_front_fp_property_popups yes)
			(pdf_back_fp_property_popups yes)
			(dxfpolygonmode yes)
			(dxfimperialunits yes)
			(dxfusepcbnewfont yes)
			(psnegative no)
			(psa4output no)
			(plotreference yes)
			(plotvalue yes)
			(plotfptext yes)
			(plotinvisibletext no)
			(sketchpadsonfab no)
			(subtractmaskfromsilk no)
			(outputformat 1)
			(mirror no)
			(drillshape 1)
			(scaleselection 1)
			(outputdirectory "")
		)
	)
	(property "PCB_REVISION" "0.0")
	(property "PROJECT_NAME" "PROJECT_NAME")
	(net 0 "")
	(net 1 "GND")
	(footprint "common:MH120X230_#4"
		(layer "F.Cu")
		(uuid "0ed882a0-e4ce-4f18-bef6-9c3cccbc2678")
		(at 123.19 123.19)
		(descr "Mounting Hole, #4")
		(property "Reference" "MH3"
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			(hide yes)
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		(sheetfile "jlcpcb_template.kicad_sch")
		(zone_connect 2)
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			(stroke
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			(layers "*.Cu" "*.Mask")
			(remove_unused_layers no)
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			(zone_connect 2)
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