kicad/templates/jlcpcb_template/jlcpcb_template.kicad_pcb

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(kicad_pcb (version 20221018) (generator pcbnew)
(general
(thickness 1.6)
)
(paper "A")
(title_block
(title "${PROJECT_NAME}")
(rev "${PCB_REVISION}")
(company "BRENDANHAINES.COM")
)
(layers
(0 "F.Cu" signal)
(1 "In1.Cu" signal)
(2 "In2.Cu" signal)
(31 "B.Cu" signal)
(32 "B.Adhes" user "B.Adhesive")
(33 "F.Adhes" user "F.Adhesive")
(34 "B.Paste" user)
(35 "F.Paste" user)
(36 "B.SilkS" user "B.Silkscreen")
(37 "F.SilkS" user "F.Silkscreen")
(38 "B.Mask" user)
(39 "F.Mask" user)
(40 "Dwgs.User" user "User.Drawings")
(41 "Cmts.User" user "User.Comments")
(42 "Eco1.User" user "User.Eco1")
(43 "Eco2.User" user "User.Eco2")
(44 "Edge.Cuts" user)
(45 "Margin" user)
(46 "B.CrtYd" user "B.Courtyard")
(47 "F.CrtYd" user "F.Courtyard")
(48 "B.Fab" user)
(49 "F.Fab" user)
(50 "User.1" user)
(51 "User.2" user)
(52 "User.3" user)
(53 "User.4" user)
(54 "User.5" user)
(55 "User.6" user)
(56 "User.7" user)
(57 "User.8" user)
(58 "User.9" user)
)
(setup
(stackup
(layer "F.SilkS" (type "Top Silk Screen") (color "White"))
(layer "F.Paste" (type "Top Solder Paste"))
(layer "F.Mask" (type "Top Solder Mask") (color "Green") (thickness 0.01))
(layer "F.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 1" (type "core") (thickness 0.48) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "In1.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 2" (type "prepreg") (thickness 0.48) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "In2.Cu" (type "copper") (thickness 0.035))
(layer "dielectric 3" (type "core") (thickness 0.48) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
(layer "B.Cu" (type "copper") (thickness 0.035))
(layer "B.Mask" (type "Bottom Solder Mask") (color "Green") (thickness 0.01))
(layer "B.Paste" (type "Bottom Solder Paste"))
(layer "B.SilkS" (type "Bottom Silk Screen") (color "White"))
(copper_finish "ENIG")
(dielectric_constraints no)
)
(pad_to_mask_clearance 0)
(pcbplotparams
(layerselection 0x00010fc_ffffffff)
(plot_on_all_layers_selection 0x0000000_00000000)
(disableapertmacros false)
(usegerberextensions false)
(usegerberattributes true)
(usegerberadvancedattributes true)
(creategerberjobfile true)
(dashed_line_dash_ratio 12.000000)
(dashed_line_gap_ratio 3.000000)
(svgprecision 4)
(plotframeref false)
(viasonmask false)
(mode 1)
(useauxorigin false)
(hpglpennumber 1)
(hpglpenspeed 20)
(hpglpendiameter 15.000000)
(dxfpolygonmode true)
(dxfimperialunits true)
(dxfusepcbnewfont true)
(psnegative false)
(psa4output false)
(plotreference true)
(plotvalue true)
(plotinvisibletext false)
(sketchpadsonfab false)
(subtractmaskfromsilk false)
(outputformat 1)
(mirror false)
(drillshape 1)
(scaleselection 1)
(outputdirectory "")
)
)
(property "PCB_REVISION" "0.0")
(property "PROJECT_NAME" "PROJECT_NAME")
(net 0 "")
(net 1 "GND")
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(tstamp 0ed882a0-e4ce-4f18-bef6-9c3cccbc2678)
(at 123.19 123.19)
(descr "Mounting Hole, #4")
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(property "Sheetname" "")
(property "ki_description" "Hole")
(path "/79801d06-18e7-498c-8d4e-cc6cc5060c9d")
(zone_connect 2)
(attr exclude_from_pos_files)
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)
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(pad "1" thru_hole circle (at 0 0) (size 5.842 5.842) (drill 3.048) (layers "*.Cu" "*.Mask")
(net 1 "GND") (pinfunction "1") (pintype "passive") (zone_connect 2) (tstamp 706a15cb-e926-49ae-94cd-c84e7fda89cd))
)
(footprint "common:LOGO_BH" (layer "F.Cu")
(tstamp 2c2034ad-58b7-4a90-9915-abf69702fa36)
(at 99.06 116.84)
(property "Sheetfile" "jlcpcb_template.kicad_sch")
(property "Sheetname" "")
(property "exclude_from_bom" "")
(path "/34f9aa7c-9331-4a4e-ada5-723181f4dcaa")
(attr smd exclude_from_pos_files exclude_from_bom allow_missing_courtyard)
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