add last remaining 3d model

common_libraries

@@ -1 +1 @@
-Subproject commit 9cb84bcc0ce06086c230b0d792624cd5c55c3ae2
+Subproject commit dca44bea5b5c0e0ebaf497a97d26612d7d9f3cf1

mellifera/mellifera.kicad_pcb

@@ -1,7 +1,7 @@
 (kicad_pcb (version 20221018) (generator pcbnew)
 
   (general
-    (thickness 1.58)
+    (thickness 1.6)
   )
 
   (paper "USLetter")
@@ -48,6 +48,9 @@
 
   (setup
     (stackup
+      (layer "F.SilkS" (type "Top Silk Screen"))
+      (layer "F.Paste" (type "Top Solder Paste"))
+      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
       (layer "F.Cu" (type "copper") (thickness 0.035))
       (layer "dielectric 1" (type "core") (thickness 0.48) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
       (layer "In1.Cu" (type "copper") (thickness 0.035))
@@ -55,6 +58,9 @@
       (layer "In2.Cu" (type "copper") (thickness 0.035))
       (layer "dielectric 3" (type "core") (thickness 0.48) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
       (layer "B.Cu" (type "copper") (thickness 0.035))
+      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
+      (layer "B.Paste" (type "Bottom Solder Paste"))
+      (layer "B.SilkS" (type "Bottom Silk Screen"))
       (copper_finish "None")
       (dielectric_constraints no)
     )
@@ -2769,32 +2775,32 @@
     (attr smd)
     (fp_text reference "SW1" (at 4.572 1.143 180) (layer "B.SilkS")
         (effects (font (size 0.635 0.635) (thickness 0.127)) (justify mirror))
-      (tstamp a9421cd9-f12a-42c9-998b-80c18195b2de)
+      (tstamp 38b86eab-285b-42f1-882d-be11fc9c8d97)
     )
     (fp_text value "TDA01H0SB1" (at 0 0 unlocked) (layer "B.Fab") hide
         (effects (font (size 0.635 0.635) (thickness 0.127)) (justify mirror))
-      (tstamp f888e687-0d80-40ee-92c6-3993edfd8e35)
+      (tstamp 59d43dad-48d3-4e81-8d90-80303265d949)
     )
     (fp_text user "${REFERENCE}" (at 0 0 unlocked) (layer "B.Fab")
         (effects (font (size 0.635 0.635) (thickness 0.127)) (justify mirror))
-      (tstamp 7936acb6-c0c0-407b-9609-9f3fb0a25502)
+      (tstamp 92d2a75d-c0da-4dbe-937f-5c5c07d35418)
     )
     (fp_line (start -3.429 -1.524) (end 3.429 -1.524)
-      (stroke (width 0.1778) (type solid)) (layer "B.SilkS") (tstamp fda74ad7-8eaa-4254-84a2-b5c36df8a49c))
+      (stroke (width 0.1778) (type solid)) (layer "B.SilkS") (tstamp 9b1fbcd5-dc7f-4168-9fe3-d50f0ca708bd))
     (fp_line (start -3.429 -0.635) (end -3.429 -1.524)
-      (stroke (width 0.1778) (type solid)) (layer "B.SilkS") (tstamp 31205cad-4970-4a90-bcb8-e14196e3a51e))
+      (stroke (width 0.1778) (type solid)) (layer "B.SilkS") (tstamp ba547ae2-c9bb-4481-9c1a-21bed016e103))
     (fp_line (start -3.429 0.635) (end -3.429 1.524)
-      (stroke (width 0.1778) (type solid)) (layer "B.SilkS") (tstamp 43a9f1f9-8c4a-468a-9612-172e59453677))
+      (stroke (width 0.1778) (type solid)) (layer "B.SilkS") (tstamp eed88ea8-9bcf-49bf-9019-6fb9282c2028))
     (fp_line (start -3.429 1.524) (end 3.429 1.524)
-      (stroke (width 0.1778) (type solid)) (layer "B.SilkS") (tstamp 4ab11173-49af-48e7-a4df-7a10079c00fa))
+      (stroke (width 0.1778) (type solid)) (layer "B.SilkS") (tstamp 434c444a-a9a2-46e0-913a-8262d4f2040d))
     (fp_line (start 3.429 -1.524) (end 3.429 -0.635)
-      (stroke (width 0.1778) (type solid)) (layer "B.SilkS") (tstamp 4669ce9a-bf3a-4361-af2e-09052d1888ca))
+      (stroke (width 0.1778) (type solid)) (layer "B.SilkS") (tstamp 0fb7c05f-8738-474f-abc4-79335bede1fc))
     (fp_line (start 3.429 1.524) (end 3.429 0.635)
-      (stroke (width 0.1778) (type solid)) (layer "B.SilkS") (tstamp d1635cce-f8be-4500-a2ab-76187626f1f5))
+      (stroke (width 0.1778) (type solid)) (layer "B.SilkS") (tstamp 83e25020-ce4d-4378-96e7-9daedb307e4a))
     (fp_rect (start -1.524 0.381) (end 0 -0.381)
-      (stroke (width 0.1778) (type solid)) (fill solid) (layer "B.SilkS") (tstamp 60a9a3b9-0647-4db6-bc3e-2bb17a3a2900))
+      (stroke (width 0.1778) (type solid)) (fill solid) (layer "B.SilkS") (tstamp 8717a3c6-f34e-412a-a97a-711b7306d68a))
     (fp_rect (start -1.524 0.381) (end 1.524 -0.381)
-      (stroke (width 0.1778) (type solid)) (fill none) (layer "B.SilkS") (tstamp 928fb3cc-df70-4976-a14b-35706e0a134d))
+      (stroke (width 0.1778) (type solid)) (fill none) (layer "B.SilkS") (tstamp a0834a05-329a-47a3-84fa-c87f06b51716))
     (fp_poly
       (pts
         (xy -3.429 0.635)
@@ -2802,9 +2808,9 @@
         (xy -2.54 1.524)
       )
 
-      (stroke (width 0.1778) (type solid)) (fill solid) (layer "B.SilkS") (tstamp aec78c81-0596-468b-81d7-6651abe49eb6))
+      (stroke (width 0.1778) (type solid)) (fill solid) (layer "B.SilkS") (tstamp be76d64a-dc8b-4003-9aea-dad6ccfea66e))
     (fp_rect (start -3.1 1.2) (end 3.1 -1.2)
-      (stroke (width 0.127) (type solid)) (fill none) (layer "B.Fab") (tstamp 6443a080-fe00-4827-aa86-63a68721dd32))
+      (stroke (width 0.127) (type solid)) (fill none) (layer "B.Fab") (tstamp fd01483b-9020-42d6-95e3-64ab277b6631))
     (fp_poly
       (pts
         (xy -3.1 -0.07)
@@ -2812,11 +2818,16 @@
         (xy -1.83 1.2)
       )
 
-      (stroke (width 0.127) (type solid)) (fill solid) (layer "B.Fab") (tstamp 41af35fe-bcda-473b-a841-66d5dcfc7857))
+      (stroke (width 0.127) (type solid)) (fill solid) (layer "B.Fab") (tstamp 730deb59-6fe6-4824-8e94-ef2133eb9966))
     (pad "1" smd roundrect (at -3.81 0 180) (size 1.27 0.76) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
-      (net 25 "/VBAT") (pinfunction "A") (pintype "passive") (tstamp 04cf8dcb-05c7-4828-9d72-66bffddbc5c2))
+      (net 25 "/VBAT") (pinfunction "A") (pintype "passive") (tstamp d46a5806-dbaa-4516-bfe9-80c647d38825))
     (pad "2" smd roundrect (at 3.81 0 180) (size 1.27 0.76) (layers "B.Cu" "B.Paste" "B.Mask") (roundrect_rratio 0.25)
-      (net 73 "Net-(SW1-B)") (pinfunction "B") (pintype "passive") (tstamp a4288c3a-2d68-4a4a-adbd-b07494110d84))
+      (net 73 "Net-(SW1-B)") (pinfunction "B") (pintype "passive") (tstamp 7afedb4c-0991-4cba-9364-21217aeaeb5d))
+    (model "step/CK_TDA01H0SB1R.step"
+      (offset (xyz 0 1.27 2.286))
+      (scale (xyz 1 1 1))
+      (rotate (xyz -90 0 90))
+    )
   )
 
   (footprint "common:R0402" (layer "B.Cu")

mellifera/mellifera.kicad_pro

@@ -98,7 +98,7 @@
         "shorting_items": "error",
         "silk_edge_clearance": "warning",
         "silk_over_copper": "warning",
-        "silk_overlap": "warning",
+        "silk_overlap": "ignore",
         "skew_out_of_range": "error",
         "solder_mask_bridge": "error",
         "starved_thermal": "error",
@@ -124,7 +124,7 @@
         "min_microvia_diameter": 0.19999999999999998,
         "min_microvia_drill": 0.09999999999999999,
         "min_resolved_spokes": 2,
-        "min_silk_clearance": -2.54,
+        "min_silk_clearance": 0.0,
         "min_text_height": 0.635,
         "min_text_thickness": 0.127,
         "min_through_hole_diameter": 0.19999999999999998,