(footprint "TE_2337857-1" (version 20210606) (generator pcbnew) (layer "F.Cu")
  (tedit 60DAB274)
  (descr "Connector, USB C, Vertical, MT")
  (fp_text reference "REF**" (at 0 -4.318 unlocked) (layer "F.SilkS")
    (effects (font (size 0.635 0.635) (thickness 0.127)))
    (tstamp 8249f250-61d7-4727-95f9-d6bcc599c9cf)
  )
  (fp_text value "TE_2337857-1" (at 0 0 unlocked) (layer "F.Fab") hide
    (effects (font (size 0.635 0.635) (thickness 0.127)))
    (tstamp 5fa6a579-363f-4225-badc-49b0862ac84b)
  )
  (fp_text user "${REFERENCE}" (at 0 0 unlocked) (layer "F.Fab")
    (effects (font (size 1.27 1.27) (thickness 0.254)))
    (tstamp 7c0bac1b-eb30-4242-97e6-b3eb0dc00360)
  )
  (fp_line (start -4.953 -2.413) (end -4.953 2.413) (layer "F.SilkS") (width 0.1778) (tstamp 7fb5ffc0-7d69-401c-9cd8-295914d78fb9))
  (fp_line (start -3.175 3.683) (end 3.175 3.683) (layer "F.SilkS") (width 0.1778) (tstamp a94f2149-c171-49fc-8c65-fa220f1b446e))
  (fp_line (start -3.175 -3.683) (end 3.175 -3.683) (layer "F.SilkS") (width 0.1778) (tstamp b138bda1-733c-4424-b8f1-13df683cc894))
  (fp_line (start 4.953 -2.413) (end 4.953 2.413) (layer "F.SilkS") (width 0.1778) (tstamp b55d526f-35c0-4398-9bed-c22dc244ace3))
  (fp_poly (pts (xy -2.794 -3.302)
    (xy -3.175 -3.683)
    (xy -2.413 -3.683)) (layer "F.SilkS") (width 0.1778) (fill solid) (tstamp d5b96cb7-0ebc-4d6a-bc75-27e62e99aaaf))
  (fp_rect (start -4.575 -3.27) (end 4.575 3.27) (layer "F.Fab") (width 0.127) (fill none) (tstamp 9c9e7866-2ab7-4835-a99e-2462afe113aa))
  (pad "0" thru_hole oval (at 4.099999 3.069999) (size 1.7 1.2) (drill oval 1.3 0.8) (layers *.Cu *.Mask) (tstamp 005b3bf1-12d7-45a5-bf96-886c9a31197d))
  (pad "0" thru_hole oval (at -4.099999 -3.069999) (size 1.7 1.2) (drill oval 1.3 0.8) (layers *.Cu *.Mask) (tstamp 2061a4e1-2157-48ac-a897-86dbb88705ad))
  (pad "0" thru_hole oval (at 4.099999 -3.069999) (size 1.7 1.2) (drill oval 1.3 0.8) (layers *.Cu *.Mask) (tstamp 4f390edc-33fa-410c-89bc-01bf651138bd))
  (pad "0" thru_hole oval (at -4.099999 3.069999) (size 1.7 1.2) (drill oval 1.3 0.8) (layers *.Cu *.Mask) (tstamp 77bd092e-fced-4ee8-b242-c27d4df389b4))
  (pad "0" thru_hole oval (at 3.774999 0) (size 1.35 0.95) (drill oval 0.95 0.55) (layers *.Cu *.Mask) (tstamp aced4683-47ac-436e-aef1-d2a30b926e3f))
  (pad "0" thru_hole oval (at -3.774999 0) (size 1.35 0.95) (drill oval 0.95 0.55) (layers *.Cu *.Mask) (tstamp d503556e-227f-4c97-919f-cd88bcab49c7))
  (pad "A1" smd roundrect (at -2.75 -2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp b6ed809d-368b-47ee-ab22-7bdf0bf6d5a4))
  (pad "A2" smd roundrect (at -2.25 -2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 33bb8d1d-e7b2-4eff-a085-2e39f9f2f4af))
  (pad "A3" smd roundrect (at -1.75 -2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 53c52bb1-fd41-4d8c-8ce7-e3ed855d78b3))
  (pad "A4" smd roundrect (at -1.25 -2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 78e0c5da-5c1e-4fb9-8ff0-64b50048caef))
  (pad "A5" smd roundrect (at -0.75 -2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 22b6555e-edca-4b15-aa24-8b38547ad3fd))
  (pad "A6" smd roundrect (at -0.25 -2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp cadf8e12-1ca5-44e9-8772-fe0b94c60c33))
  (pad "A7" smd roundrect (at 0.25 -2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp d0e988ee-1eb6-4993-9978-edd7d4978724))
  (pad "A8" smd roundrect (at 0.75 -2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp d0e59ea8-0105-4391-9d19-65d9fdf22f14))
  (pad "A9" smd roundrect (at 1.25 -2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp ba0f051c-d65b-41b2-9ecf-74ff326ef75c))
  (pad "A10" smd roundrect (at 1.75 -2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 27b335c4-a2b9-4952-a9e8-c4f729adef59))
  (pad "A11" smd roundrect (at 2.25 -2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp b2b11f71-daec-4ec5-8e0c-6bccf7ebf616))
  (pad "A12" smd roundrect (at 2.75 -2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp ae69e84e-42dd-4de8-9dc3-86f074ac949d))
  (pad "B1" smd roundrect (at 2.75 2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 8a2101fc-ba83-45e5-84ea-ec02966642a3))
  (pad "B2" smd roundrect (at 2.25 2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 8a5890f3-d361-4fe6-9f96-923583686d4d))
  (pad "B3" smd roundrect (at 1.75 2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 0307c0be-f1e8-4410-8cee-612e184984ec))
  (pad "B4" smd roundrect (at 1.25 2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp db7e1555-2f20-482f-9e13-9083999ddee2))
  (pad "B5" smd roundrect (at 0.75 2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 596ca354-b233-4d3d-aa0b-3c017d5951f7))
  (pad "B6" smd roundrect (at 0.25 2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 1c155534-c279-406a-8838-3995a40011c7))
  (pad "B7" smd roundrect (at -0.25 2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 53d3b451-5103-4622-a652-c9a0b7c55078))
  (pad "B8" smd roundrect (at -0.75 2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 7d59a61d-b807-4948-8fe9-aeb2b7341f75))
  (pad "B9" smd roundrect (at -1.25 2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 9219da04-aff1-49a4-b708-68075e8a8130))
  (pad "B10" smd roundrect (at -1.75 2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp a281d6c5-3c08-4c5c-bf08-2c0a31a982af))
  (pad "B11" smd roundrect (at -2.25 2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 37313054-b77b-4e9e-a51c-3c46603a4468))
  (pad "B12" smd roundrect (at -2.75 2.3) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 13acc5d2-63c2-4d16-92e0-bf166df070d5))
  (model "step/TE_2337857-1.step"
    (offset (xyz 0 0 12))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)