fix footprint issues
This commit is contained in:
parent
34a923fa19
commit
428825d8db
51
common.pretty/QFN65P400X400X80-16P_FT230XQ.kicad_mod
Executable file → Normal file
51
common.pretty/QFN65P400X400X80-16P_FT230XQ.kicad_mod
Executable file → Normal file
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@ -1,5 +1,5 @@
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(footprint "QFN65P400X400X80-16P_FT230XQ" (version 20211014) (generator pcbnew) (layer "F.Cu")
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(footprint "QFN65P400X400X80-16P_FT230XQ" (version 20221018) (generator pcbnew)
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(tedit 61884065)
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(layer "F.Cu")
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(descr "Matches FT230XQ pads")
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(descr "Matches FT230XQ pads")
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(attr through_hole)
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(attr through_hole)
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(fp_text reference "REF**" (at 0 -3.048) (layer "F.SilkS")
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(fp_text reference "REF**" (at 0 -3.048) (layer "F.SilkS")
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@ -14,29 +14,42 @@
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(effects (font (size 0.635 0.635) (thickness 0.127)))
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(effects (font (size 0.635 0.635) (thickness 0.127)))
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(tstamp 4c19ca2e-7a48-4da1-b131-cb973e19fcd5)
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(tstamp 4c19ca2e-7a48-4da1-b131-cb973e19fcd5)
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)
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)
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(fp_line (start -1.397 -2.413) (end -1.651 -2.413) (layer "F.SilkS") (width 0.1778) (tstamp 0411f564-3f4d-4b70-b118-d1946830f423))
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(fp_line (start -2.413 -1.651) (end -2.413 -1.397)
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(fp_line (start -2.413 -1.651) (end -2.413 -1.397) (layer "F.SilkS") (width 0.1778) (tstamp 1176268d-e96d-4d77-8032-4a3052122830))
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(stroke (width 0.1778) (type solid)) (layer "F.SilkS") (tstamp 1176268d-e96d-4d77-8032-4a3052122830))
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(fp_line (start 2.413 1.524) (end 2.413 2.413) (layer "F.SilkS") (width 0.1778) (tstamp 4320227c-cfdd-49ea-8ddc-b7b95aa9dfb5))
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(fp_line (start -2.413 2.413) (end -2.413 1.524)
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(fp_line (start -1.524 2.413) (end -2.413 2.413) (layer "F.SilkS") (width 0.1778) (tstamp 4fcc72ce-a356-4154-8428-c6b24183adc8))
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(stroke (width 0.1778) (type solid)) (layer "F.SilkS") (tstamp e2cde14d-3abf-4848-9f14-7b922302803e))
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(fp_line (start 1.524 -2.413) (end 2.413 -2.413) (layer "F.SilkS") (width 0.1778) (tstamp 5298aac6-a6f2-416d-8897-4d1e8fa9b23d))
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(fp_line (start -1.524 2.413) (end -2.413 2.413)
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(fp_line (start 2.413 -2.413) (end 2.413 -1.524) (layer "F.SilkS") (width 0.1778) (tstamp 572b32b9-7b7d-4e4f-a4ef-f1b43503d1b3))
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(stroke (width 0.1778) (type solid)) (layer "F.SilkS") (tstamp 4fcc72ce-a356-4154-8428-c6b24183adc8))
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(fp_line (start 2.413 2.413) (end 1.524 2.413) (layer "F.SilkS") (width 0.1778) (tstamp 7ba5cf82-b32c-49d5-9ff9-ea9ee58f9622))
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(fp_line (start -1.397 -2.413) (end -1.651 -2.413)
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(fp_line (start -2.413 2.413) (end -2.413 1.524) (layer "F.SilkS") (width 0.1778) (tstamp e2cde14d-3abf-4848-9f14-7b922302803e))
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(stroke (width 0.1778) (type solid)) (layer "F.SilkS") (tstamp 0411f564-3f4d-4b70-b118-d1946830f423))
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(fp_arc (start -2.413 -1.651) (mid -2.189815 -2.189815) (end -1.651 -2.413) (layer "F.SilkS") (width 0.1778) (tstamp 53f642e9-78e3-4239-94df-16fb4ac138d8))
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(fp_line (start 1.524 -2.413) (end 2.413 -2.413)
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(fp_rect (start -2 -2) (end 2 2) (layer "F.Fab") (width 0.127) (fill none) (tstamp acf6c997-336a-4e7e-b11f-b047b0484568))
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(stroke (width 0.1778) (type solid)) (layer "F.SilkS") (tstamp 5298aac6-a6f2-416d-8897-4d1e8fa9b23d))
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(fp_poly (pts
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(fp_line (start 2.413 -2.413) (end 2.413 -1.524)
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(stroke (width 0.1778) (type solid)) (layer "F.SilkS") (tstamp 572b32b9-7b7d-4e4f-a4ef-f1b43503d1b3))
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(fp_line (start 2.413 1.524) (end 2.413 2.413)
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(stroke (width 0.1778) (type solid)) (layer "F.SilkS") (tstamp 4320227c-cfdd-49ea-8ddc-b7b95aa9dfb5))
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(fp_line (start 2.413 2.413) (end 1.524 2.413)
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(stroke (width 0.1778) (type solid)) (layer "F.SilkS") (tstamp 7ba5cf82-b32c-49d5-9ff9-ea9ee58f9622))
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(fp_arc (start -2.413 -1.651) (mid -2.189815 -2.189815) (end -1.651 -2.413)
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(stroke (width 0.1778) (type solid)) (layer "F.SilkS") (tstamp 53f642e9-78e3-4239-94df-16fb4ac138d8))
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(fp_rect (start -2 -2) (end 2 2)
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(stroke (width 0.127) (type solid)) (fill none) (layer "F.Fab") (tstamp acf6c997-336a-4e7e-b11f-b047b0484568))
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(fp_poly
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(pts
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(xy -1 -2)
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(xy -1 -2)
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(xy -2 -1)
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(xy -2 -1)
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(xy -2 -2)
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(xy -2 -2)
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) (layer "F.Fab") (width 0.127) (fill solid) (tstamp 57a925a9-75dc-4ec5-b7b1-e54c41dbf9ed))
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)
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(stroke (width 0.127) (type solid)) (fill solid) (layer "F.Fab") (tstamp 57a925a9-75dc-4ec5-b7b1-e54c41dbf9ed))
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(pad "0" smd rect (at -0.525 -0.525) (size 1.05 1.05) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "0" smd rect (at -0.525 -0.525) (size 1.05 1.05) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin -0.75) (tstamp cc16a017-4f33-4590-a7fd-a78a040dc3fc))
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(solder_paste_margin -0.127) (tstamp cc16a017-4f33-4590-a7fd-a78a040dc3fc))
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(pad "0" smd rect (at 0.525 -0.525) (size 1.05 1.05) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin -0.75) (tstamp cc16a017-4f33-4590-a7fd-a78a040dc3fc))
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(pad "0" smd rect (at -0.525 0.525) (size 1.05 1.05) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "0" smd rect (at -0.525 0.525) (size 1.05 1.05) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin -0.75) (tstamp cc16a017-4f33-4590-a7fd-a78a040dc3fc))
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(solder_paste_margin -0.127) (tstamp cc16a017-4f33-4590-a7fd-a78a040dc3fc))
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(pad "0" smd rect (at 0.525 -0.525) (size 1.05 1.05) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin -0.127) (tstamp cc16a017-4f33-4590-a7fd-a78a040dc3fc))
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(pad "0" smd rect (at 0.525 0.525) (size 1.05 1.05) (layers "F.Cu" "F.Paste" "F.Mask")
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(pad "0" smd rect (at 0.525 0.525) (size 1.05 1.05) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_paste_margin -0.75) (tstamp cc16a017-4f33-4590-a7fd-a78a040dc3fc))
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(solder_paste_margin -0.127) (tstamp cc16a017-4f33-4590-a7fd-a78a040dc3fc))
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(pad "1" smd rect (at -1.825 -0.975 90) (size 0.37 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 36e01a95-8569-438f-b984-f242d9696343))
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(pad "1" smd rect (at -1.825 -0.975 90) (size 0.37 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 36e01a95-8569-438f-b984-f242d9696343))
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(pad "2" smd rect (at -1.825 -0.325 90) (size 0.37 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 36e01a95-8569-438f-b984-f242d9696343))
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(pad "2" smd rect (at -1.825 -0.325 90) (size 0.37 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 36e01a95-8569-438f-b984-f242d9696343))
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(pad "3" smd rect (at -1.825 0.325 90) (size 0.37 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 36e01a95-8569-438f-b984-f242d9696343))
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(pad "3" smd rect (at -1.825 0.325 90) (size 0.37 0.45) (layers "F.Cu" "F.Paste" "F.Mask") (tstamp 36e01a95-8569-438f-b984-f242d9696343))
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10
common.pretty/TIE_5X5.kicad_mod
Executable file → Normal file
10
common.pretty/TIE_5X5.kicad_mod
Executable file → Normal file
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@ -1,6 +1,7 @@
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(footprint "TIE_5X5" (version 20210606) (generator pcbnew) (layer "F.Cu")
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(footprint "TIE_5X5" (version 20221018) (generator pcbnew)
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(tedit 60DABABC)
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(layer "F.Cu")
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(attr exclude_from_bom)
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(attr exclude_from_pos_files exclude_from_bom allow_missing_courtyard)
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(net_tie_pad_groups "1, 2")
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(fp_text reference "REF**" (at 0 -0.508 unlocked) (layer "F.SilkS") hide
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(fp_text reference "REF**" (at 0 -0.508 unlocked) (layer "F.SilkS") hide
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(effects (font (size 0.635 0.635) (thickness 0.127)))
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(effects (font (size 0.635 0.635) (thickness 0.127)))
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(tstamp 0af967b5-aeb6-4d20-8329-d5e88c818fbd)
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(tstamp 0af967b5-aeb6-4d20-8329-d5e88c818fbd)
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@ -13,7 +14,8 @@
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(effects (font (size 0.635 0.635) (thickness 0.127)))
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(effects (font (size 0.635 0.635) (thickness 0.127)))
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(tstamp 9f565936-009f-461e-83c9-e925ee1f6523)
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(tstamp 9f565936-009f-461e-83c9-e925ee1f6523)
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)
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)
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(fp_line (start -0.127 0) (end 0.127 0) (layer "F.Cu") (width 0.127) (tstamp f16c09bc-d119-42a4-b901-d6d0cd1b905e))
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(fp_line (start -0.127 0) (end 0.127 0)
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(stroke (width 0.127) (type solid)) (layer "F.Cu") (tstamp f16c09bc-d119-42a4-b901-d6d0cd1b905e))
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(pad "1" smd circle (at -0.127 0) (size 0.127 0.127) (layers "F.Cu") (tstamp 6ad0c321-cb1a-4c29-aa70-2cb169ecb39f))
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(pad "1" smd circle (at -0.127 0) (size 0.127 0.127) (layers "F.Cu") (tstamp 6ad0c321-cb1a-4c29-aa70-2cb169ecb39f))
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(pad "2" smd circle (at 0.127 0) (size 0.127 0.127) (layers "F.Cu") (tstamp d690e839-71e5-4d36-8eeb-5c5dc6fd05de))
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(pad "2" smd circle (at 0.127 0) (size 0.127 0.127) (layers "F.Cu") (tstamp d690e839-71e5-4d36-8eeb-5c5dc6fd05de))
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)
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)
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