84 lines
7.2 KiB
Plaintext
84 lines
7.2 KiB
Plaintext
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(footprint "Conn_FFC_Molex_5051102291-Adafruit_4421" (version 20210126) (generator pcbnew) (layer "F.Cu")
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(tedit 60233413)
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(fp_text reference "REF**" (at 0 4.064 unlocked) (layer "F.SilkS")
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(effects (font (size 0.762 0.762) (thickness 0.127)))
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(tstamp c46166d0-c44f-439f-8e13-0b5a562b61f3)
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)
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(fp_text value "Conn_FFC_Molex_5051102291-Adafruit_4421" (at 0 0.762 unlocked) (layer "F.Fab")
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(effects (font (size 0.762 0.762) (thickness 0.127)))
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(tstamp 10f85b1d-50a4-44f3-a3e3-f3e03c2f7a47)
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)
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(fp_text user "${REFERENCE}" (at 0 1.905 unlocked) (layer "F.Fab")
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(effects (font (size 0.762 0.762) (thickness 0.127)))
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(tstamp 3c1eb4f5-4668-4935-aab9-5af309842fd8)
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)
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(fp_line (start -15.76 12.87) (end 15.76 12.87) (layer "B.SilkS") (width 0.127) (tstamp 04a482d3-b9d2-4ccf-8a71-51ceb8182c56))
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(fp_line (start 15.76 12.87) (end 15.76 -21.83) (layer "B.SilkS") (width 0.127) (tstamp 1b55aafd-911d-4e7f-9b46-626bb5adf811))
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(fp_line (start 15.76 -21.83) (end -15.76 -21.83) (layer "B.SilkS") (width 0.127) (tstamp 402cdf92-49aa-4986-838a-61f9ae4f1ec6))
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(fp_line (start -15.76 -21.83) (end -15.76 12.87) (layer "B.SilkS") (width 0.127) (tstamp 794c851c-c9ab-4675-8ddd-59fc68610d77))
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(fp_line (start -8.763 2.54) (end -8.763 1.016) (layer "F.SilkS") (width 0.1778) (tstamp bfb83591-37df-4362-bcd4-54e41a283b8d))
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(fp_line (start 8.255 2.54) (end 5.715 2.54) (layer "F.SilkS") (width 0.1778) (tstamp cf1dd5e8-a1f7-406d-bbe3-326027449c43))
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(fp_line (start 8.255 1.016) (end 8.255 2.54) (layer "F.SilkS") (width 0.1778) (tstamp e8ec9eba-3452-4986-9f72-e8b6ad19dc4c))
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(fp_line (start -5.715 2.54) (end -8.763 2.54) (layer "F.SilkS") (width 0.1778) (tstamp fe908754-67d2-4cee-8e90-4bf1e835cae1))
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(fp_line (start -9 -3.73) (end 8.5 -3.73) (layer "B.Fab") (width 0.127) (tstamp 3b07d6d8-1ed2-41c1-ba80-8949f0f248a3))
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(fp_line (start -13.6 11.37) (end 13.6 11.37) (layer "B.Fab") (width 0.127) (tstamp 7996f583-1696-4e1d-9b91-a3fc8b27b975))
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(fp_line (start 8.5 -8.73) (end -9 -8.73) (layer "B.Fab") (width 0.127) (tstamp 91e0de82-b0bb-44cc-9598-6be67dc24c6e))
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(fp_line (start 13.6 -15.83) (end -13.6 -15.83) (layer "B.Fab") (width 0.127) (tstamp affc35a2-9b20-4a33-92eb-cbb9ce309fbe))
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(fp_line (start 8.5 -3.73) (end 8.5 -8.73) (layer "B.Fab") (width 0.127) (tstamp bc78e1e9-af70-426e-85c0-e402280093e1))
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(fp_line (start -13.6 -15.83) (end -13.6 11.37) (layer "B.Fab") (width 0.127) (tstamp c1ae3929-d24a-48d6-9a02-4252c0a58edd))
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(fp_line (start 13.6 11.37) (end 13.6 -15.83) (layer "B.Fab") (width 0.127) (tstamp d0e4a659-3c77-4c36-b879-e4a54a1caec6))
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(fp_line (start 7.8 -2.278) (end -8.3 -2.278) (layer "F.Fab") (width 0.2032) (tstamp 22cba89e-102e-4be5-a194-67ad17790e8d))
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(fp_line (start -8.3 2.122) (end -8.3 -2.278) (layer "F.Fab") (width 0.2032) (tstamp 27974875-f29f-4c06-a155-18dd5b565bb2))
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(fp_line (start 7.8 2.122) (end -8.3 2.122) (layer "F.Fab") (width 0.2032) (tstamp 815bdb4d-6a78-4d90-bea0-8dd118e6d054))
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(fp_line (start 7.8 2.122) (end 7.8 -2.278) (layer "F.Fab") (width 0.2032) (tstamp de694dd5-d445-4420-8983-d50ca118958d))
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(pad "0" smd rect (at -8.4 -0.428 180) (size 1.6 2.2) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp 7b5f14d7-b62a-4586-ad8c-8561ab9001fc))
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(pad "0" smd rect (at 7.9 -0.428 180) (size 1.6 2.2) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp e913cd1f-f3d1-486a-8efe-d7fa36714de6))
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(pad "1" smd rect (at 5.25 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp 410e5df9-3f12-45f6-ae06-2ff45cb43bf2))
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(pad "2" smd rect (at 4.75 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp b038625b-c4ab-478a-93d8-c292df640825))
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(pad "3" smd rect (at 4.25 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp 6116d6c3-a02c-465f-840c-b06f0c3f65c1))
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(pad "4" smd rect (at 3.75 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp a312c36f-387d-49be-90f4-2d614526c081))
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(pad "5" smd rect (at 3.25 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp 29b49046-b2c8-482e-9e92-e34d290c076c))
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(pad "6" smd rect (at 2.75 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp 59130ecc-b23c-4254-9087-4ac0d4d0b838))
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(pad "7" smd rect (at 2.25 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp 5861ad83-2b6b-4919-8029-c2b83a08429e))
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(pad "8" smd rect (at 1.75 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp 367436ed-bd50-42b3-a102-f0ca855aeb2f))
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(pad "9" smd rect (at 1.25 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp 38d9cfc1-afda-4e38-8e51-6a159d662957))
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(pad "10" smd rect (at 0.75 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp f9759d56-618c-4bc7-a672-dd1b73acdf78))
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(pad "11" smd rect (at 0.25 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp a67c05d3-ebe1-4e12-930c-3ca1b5fc02df))
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(pad "12" smd rect (at -0.25 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp fa6b582a-5ad2-4598-9556-9868498930a5))
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(pad "13" smd rect (at -0.75 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp f7e7fe45-81cb-44f3-8f74-99b7d1b297a6))
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(pad "14" smd rect (at -1.25 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp de73eab5-72b7-4775-ac3e-b58939bf5a05))
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(pad "15" smd rect (at -1.75 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp a8290b19-cf95-4fd8-849b-c020e6805a49))
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(pad "16" smd rect (at -2.25 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp 5c406bdd-57f2-4caa-bb71-e8ebec84e603))
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(pad "17" smd rect (at -2.75 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp cb0ef286-baf0-4504-b716-10f72e473b81))
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(pad "18" smd rect (at -3.25 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp 5c5feb0b-ad19-4f23-9e36-2d76d01ad17c))
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(pad "19" smd rect (at -3.75 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp 7ebb8116-55ff-4647-abd5-04c6dfc1c57c))
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(pad "20" smd rect (at -4.25 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp 8addc8c5-762e-4bd4-b20f-29a43ae60197))
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(pad "21" smd rect (at -4.75 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp 3a674ef1-58a0-4c0b-b616-de42f509c193))
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(pad "22" smd rect (at -5.25 2.722 180) (size 0.25 1.4) (layers "F.Cu" "F.Paste" "F.Mask")
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(solder_mask_margin 0.0508) (tstamp d72000c8-4954-4993-9214-ce62ce6fe056))
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)
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